2-Layer PCB Calculator

RayPCB Engineering Tools

Trace Width Calculator (IPC-2221)

A
°C
Minimum Width
--mil
Recommended
--mil

Current vs Trace Width Reference

CurrentMin Width (1oz)Recommended
0.5 A10 mil15-20 mil
1.0 A20 mil30-40 mil
2.0 A50 mil70-100 mil
3.0 A100 mil150+ mil
5.0 A200 milUse polygon
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Tip: Values based on 10°C temperature rise. For higher currents, use copper pours or increase copper weight to 2oz.

Via Size Calculator

A
μm
Via Pad Diameter
--mm
Current Capacity
--A
Vias Needed
--pcs
Resistance
--

Via Design Tips

1
Standard Via: 0.3mm drill / 0.6mm pad is the most cost-effective option.
2
Via Spacing: Maintain ≥0.5mm via-to-via and ≥0.3mm via-to-pad clearance.
3
Power Vias: Use multiple vias in parallel for high-current paths (2+ vias per amp).
4
Thermal Vias: For exposed pads, use 5-9 vias in a grid pattern with 0.3mm drill.

Microstrip Impedance Calculator

mil
mil
mil
Characteristic Impedance (Z₀)
--Ω
Effective Er
--
Delay
--ps/in

Common Impedance Targets

ApplicationTarget Z₀Typical Width
Single-ended signals50 Ω~10 mil (1.6mm FR-4)
USB 2.090 Ω (diff)~8 mil, 6 mil space
LVDS100 Ω (diff)~6 mil, 8 mil space
RF/Antenna50 ΩWidth depends on Er

DFM Rule Checker

mil
mil
mm
mil
mil
mil

2-Layer Stackup Visualizer

Solder Mask (Top)~20 μm
Copper (Top Layer)35 μm
FR-4 Core Dielectric1.5 mm
Copper (Bottom Layer)35 μm
Solder Mask (Bottom)~20 μm
1.6
Total (mm)
1.5
Dielectric (mm)
4.5
Er (FR-4)

Cost Estimator

mm
×
mm
Base PCB (2-Layer)$--
Surface Finish$--
Estimated Total$--
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Cost Saving Tip: Order standard 1.6mm thickness with HASL finish for best price.

Cost Optimization Tips

1
Use 6/6 mil trace/space rules instead of 4/4 mil to save 25-40%.
2
Choose 0.3mm vias over 0.2mm laser vias to save 30-50%.
3
Select HASL finish instead of ENIG unless needed for fine-pitch BGAs.
4
Order 20+ pieces to unlock volume pricing discounts of 15-25%.
5
Use standard lead time (7-10 days) vs express to save 50-200%.